====== THVP ======

The THVP (Trivial High Voltage Programmer), designed by Byron A. Jeff, is a PIC programmer for the Parallel Port.
It is similar to other Tait-style parallel port programmers.
Byron's THVP page can be found here: http://www.finitesite.com/d3jsys/proghvp.html

I had been using my first one (built on a veroboard) for a few years, but wanted some real PCBs. 
So I started eagle (http://www.cadsoft.de) and layouted the schematic as a single-sided board
that would be cheap to have made at a board house.

My THVP board already incorporates the "long cable termination scheme".
Since I designed the board to be used for ICSP (Microchip's name for  in-circuit programming),
I also designed a companion board (ICSP2DIP) where at least the 16,18,28,40pin DIP packaged PICs can be plugged in
if your circuits don't have ICSP capability. (Well, I copied the schematic from Olimex's PG2C, but the layout is my own)

===== Here's how they look:=====
{{:thvp.jpg|:thvp.jpg}} {{:icsp2dip.jpg|:icsp2dip.jpg}}\\
{{:thvp.png|:thvp.png}}{{:icsp2dip.png|:icsp2dip.png}}\\

===== Construction Tutorial =====
My construction tutorial can be found here: http://projects.varxec.net/images/thvp/gal/thvp_assembly_galleryidxplusdesc.html


===== Download =====
Here are the files in eagle format, gerber, and postscript:

==== Eagle Format ====
**THVP**\\
Schematic: http://projects.varxec.net/mbuploads/THVP.sch\\
Layout: http://projects.varxec.net/mbuploads/THVP.brd\\

**ICSP2DIP**\\
Schematic: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.sch\\
Layout: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.brd\\

==== Gerber Format ====
**THVP**\\
Bottom/Solder Side Pads/Traces: http://projects.varxec.net/mbuploads/THVP.sol\\
Bottom/Solder Side Solder Mask: http://projects.varxec.net/mbuploads/THVP.sts\\
Outline/Milling Layer: http://projects.varxec.net/mbuploads/THVP.oul\\
Silk Screen: http://projects.varxec.net/mbuploads/THVP.plc\\
Drills: http://projects.varxec.net/mbuploads/THVP.drd\\
Drillrack:  http://projects.varxec.net/mbuploads/MB_drillrack1.drl\\

**ICSP2DIP**\\
Bottom/Solder Side Pads/Traces: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.sol\\
Bottom/Solder Side Solder Mask: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.sts\\
Top Pads/Traces: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.cmp\\
Top Solder Mask: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.stc\\
Outline/Milling Layer: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.oul\\
Silk Screen: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.plc\\
Drills: http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.drd\\
Drillrack:  http://projects.varxec.net/mbuploads/MB_drillrack1.drl\\

==== Postscript Format ====
**THVP**\\
Bottom Layer (traces/pads): http://projects.varxec.net/mbuploads/THVP.bot_ps\\
dito, mirrored:http://projects.varxec.net/mbuploads/THVP.bot_mir_ps\\
Silk Screen Layer:http://projects.varxec.net/mbuploads/THVP.silk_ps\\
dito, mirrored:http://projects.varxec.net/mbuploads/THVP.silk_mir_ps\\

**ICSP2DIP**\\
Bottom Layer (traces/pads): http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.bot_ps\\
dito, mirrored:http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.bot_mir_ps\\
Top Layer (traces/pads):http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.top_ps\\
dito, mirrored:http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.top_mir_ps\\
Silk Screen Layer:http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.silk_ps\\
dito, mirrored:http://projects.varxec.net/mbuploads/PIC_prog_ICSP2DIP.silk_mir_ps\\

===== Software Support =====
I'm using Pikdev's commandline programming utility ''pkp'' with the THVP.
Here's my .pkprc
   port=/dev/parport0
   type=parallel
   vpp=-4
   vdd=6
   clock=3
   datao=2
   datai=10

===== More Info =====
There's at least one thread about the THVP in my PHCC Forum:\\
http://forums.varxec.net/index.php?t=msg&th=141&start=0&rid=3